Unit for supplying fluid, apparatus and method for treating substrate with the unit
US10109506B2 · kind B2 · utility
6Cited by
13References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2017 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | May 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is an apparatus and method for supplying a fluid. The substrate treating apparatus comprises a treating unit for treating a substrate and a fluid supply unit for supplying fluid to the treating unit, wherein the fluid supply unit comprises a supply tank in which the fluid is stored, a supply line connecting the supply tank and the treating unit to supply the fluid from the supply tank to the treating unit, a filter installed on the supply line, and an exhaust line branching from the supply line, wherein a branch point of the exhaust line in the supply line is located upstream of the filter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.