Substrate processing device and method of manufacturing semiconductor device
US10109508B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2017 |
| Grant date | Oct 23, 2018 |
| Priority date | — |
| Expiry date | Mar 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing device includes a bath configured to accommodate a plurality of substrates and configured to store a liquid for etching the plurality of substrates, a plurality of bubble generators configured to generate bubbles in the liquid, the bubble generators provided so as to correspond to each of the plurality of substrates, a measurement device configured to measure the generation state of the bubbles of at least one of the plurality of bubble generators, and a control device configured to individually control at least one of the plurality of bubble generators based on the measurement result of the measurement device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.