Patent · US Active

Connection structure and electronic component

US10109609B2 · kind B2 · utility

0Cited by

4References

25Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Ralf Otremba · Kaufbeuren, DE
Josef Höglauer · Heimstetten, DE
Jürgen Schredl · Mering, DE
Xaver Schlögel · Sachsenkam, DE
Klaus Schiess · Allensbach, DE

Key dates

Filing date	Jan 13, 2014
Grant date	Oct 23, 2018
Priority date	—
Expiry date	Oct 7, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A connection structure is provided that includes a semiconductor substrate, a first layer arranged on the semiconductor substrate, the first layer being configured to provide shielding against radioactive rays, a second layer arranged on the first layer, the second layer including solder including Pb, and an electrically conductive member arranged on the second layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.