Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatus
US10112376B2 · kind B2 · utility
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25References
13Claims
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Key dates
| Filing date | May 9, 2016 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | May 25, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An inter-substrate material layer is formed between a first substrate and a second substrate to generate a bonding strength. A plurality of metal elements are present in the inter-substrate material layer. An interface element existence ratio of the plurality of metal elements is 0.07 or above. A device can be obtained in which substrates difficult to bond (for example, SiO2 substrates) are bonded at room-temperature to have practical bonding strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.