Substrate inspection apparatus
US10114070B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2014 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Feb 5, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2896
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A substrate inspection apparatus can efficiently inspect electric characteristics of the semiconductor device. A prober 10 includes a probe card 15 having a multiple number of probe needles 17 to be brought into contact with electrodes of a semiconductor device formed on a wafer W; and a test box 14 electrically connected to the probe card 15. A card-side inspection circuit of the probe card 15 reproduces a circuit configuration on which the semiconductor device is to be mounted after separated from the wafer W, e.g., the circuit configuration of a function extension card, and a box-side inspection circuit 21 of the test box 14 reproduces a circuit configuration on which the semiconductor device is to be mounted, e.g., a part of the circuit configuration of the mother board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.