Substrate processing apparatus and substrate processing method
US10121646B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2017 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Nov 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to remove from a substrate having a concavo-convex pattern formed on a surface of the substrate, a solid material with which a concave portion of the concavo-convex pattern is filled and which is formed by evaporating a solvent in a sublimable substance solution containing a sublimable substance that sublimates at a temperature equal to or higher than a first temperature, and an impurity that evaporates at a temperature equal to or higher than a second temperature that is higher than the first temperature, the prevent invention provides a substrate processing apparatus and a substrate processing method which heat the substrate to a temperature equal to or higher than the second temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.