Cooler for semiconductor devices

US10121726B2 · kind B2 · utility

Assignee

• Intel IP Corporation · US

Inventors

• Sven Albers · Regensburg, DE
• Klaus Reingruber · Langquaid, DE
• Andreas Wolter · Regensburg, DE
• Georg Seidemann · Landshut, DE
• Christian Geissler · Teugn, DE
• Alexandra Atzesdorfer · Weil am Rhein, DE
• Sonja Koller · Regensburg, DE

Key dates

• Filing date: Aug 28, 2015
• Grant date: Nov 6, 2018
• Expiry date: Sep 28, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of the present disclosure relate to a cooler for semiconductor devices. The semiconductor device may be electrically coupleable to a power source. The device may generate heat when the power source supplies power to the device during use of the device. The cooler may be coupled to one or more surfaces of the device. The cooler may include a hydrophilic material to adsorb water from ambient air. During operation of the device, the cooler may cool the device by conduction of heat away from the device to the cooler. The cooler may include water that is evaporated during use of the device to increase cooling capacity of the cooler. The cooler may be recharged with water from humidity in air when the device is not operated or operated at a lower power level. Other embodiments may be described and/or claimed.