Wafer bonding system and method
US10121760B2 · kind B2 · utility
1Cited by
8References
34Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 21, 2014 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Dec 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer bonding system and method using a combination of heat and a pneumatic force to bond two wafers held together in alignment. The wafers are heated via a non-contact, gaseous interface, thermal path between heating elements and the wafers. The pneumatic force is created by a pressure differential between a first pressure surrounding the two wafers and a second pressure, which is less than the first pressure, maintained between the two wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.