Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device
US10123433B2 · kind B2 · utility
8Cited by
2References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2016 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Aug 12, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12438
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 0.1 to 5 grains/μm2, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.