Terumasa Moriyama
7Patents
3h-index
3Co-inventors
42Inventor score
Filing activity: May 29, 2009 → Feb 5, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8142905B2 | Copper foil for printed circuit board and copper clad laminate for printed circuit board | Emerging Cross-Sectional Technologies | 10 | Active |
| US10123433B2 | Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device | Emerging Cross-Sectional Technologies | 8 | Active |
| US9028972B2 | Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring board | Emerging Cross-Sectional Technologies | 3 | Active |
| US10332756B2 | Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device | Emerging Cross-Sectional Technologies | 2 | Active |
| US9578741B2 | Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring board | Emerging Cross-Sectional Technologies | 0 | Active |
| US9788423B2 | Copper foil with carrier | Emerging Cross-Sectional Technologies | 0 | Active |
| US11401612B2 | Surface-treated copper foil, copper foil having carrier, laminated material, method for producing printed wiring board, and method for producing electronic apparatus | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.