Package with vertically spaced partially encapsulated contact structures

US10128165B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Wolfram Hable · Dresden, DE
• Andreas Grassmann · Villach, AT
• Juergen Hoegerl · Regensburg, DE
• Eduard Knauer · Deuerling, DE
• Michael Ledutke · Ribnitz-Damgarten, DE

Key dates

• Filing date: Oct 28, 2017
• Grant date: Nov 13, 2018
• Expiry date: Oct 28, 2037

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02T10/64
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A package comprising at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, a first electrically conductive contact structure extending partially within and partially outside of the encapsulant and being electrically coupled with at least one first terminal of at least one of the at least one electronic chip, and a second electrically conductive contact structure extending partially within and partially outside of the encapsulant and being electrically coupled with at least one second terminal of at least one of the at least one electronic chip, wherein at least a portion of the first electrically conductive contact structure and at least a portion of the second electrically conductive contact structure within the encapsulant are spaced in a direction between two opposing main surfaces of the package.