Conductive clip connection arrangements for semiconductor packages
US10128170B2 · kind B2 · utility
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4References
24Claims
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Key dates
| Filing date | Jan 9, 2017 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | Jan 9, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Conductive clip connection arrangements for semiconductor packages are disclosed. Some examples provide electrically conductive clip connection arrangements for semiconductor packages that improve electrical performance and fabrication reliability while maintaining compatibility with existing quality control processes. Some examples provide innovative conductive clip structures and die pad arrangements that broaden the range of options available for tailoring the physical configurations of one or more of the constituent conductive clips and/or die pads to achieve specific electrical performance targets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.