Patent · US Active

Fan-out package structure

US10128192B2 · kind B2 · utility

2Cited by

2References

15Claims

0Family size

Assignee

MEDIATEK INC. · TW

Inventors

Min-Chen Lin · Tainan, TW
Che-Ya Chou
Nan-Cheng Chen · Baoshan, TW

Key dates

Filing date	Apr 27, 2017
Grant date	Nov 13, 2018
Priority date	—
Expiry date	Apr 27, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/37001
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package structure including a redistribution layer (RDL) structure having a first surface and a second surface opposite thereto is provided. The RDL structure includes an inter-metal dielectric (IMD) layer and a first conductive layer disposed at a first layer-level of the IMD layer. A molding compound covers the first surface of the RDL structure. A first semiconductor die is disposed over the second surface of the RDL structure and electrically coupled to the RDL structure. A plurality of bump structures is disposed over the second surface of the RDL structure and electrically coupled to the RDL structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.