Min-Chen Lin
7Patents
2h-index
10Co-inventors
40Inventor score
Filing activity: Mar 13, 2013 → Jul 22, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8916972B2 | Adhesion between post-passivation interconnect structure and polymer | Electricity | 12 | Active |
| US10847869B2 | Semiconductor package having discrete antenna device | Electricity | 7 | Active |
| US10128192B2 | Fan-out package structure | Electricity | 2 | Active |
| US11688728B2 | Integrated circuit structure and method for reducing polymer layer delamination | Electricity | 0 | Active |
| US9583424B2 | Integrated circuit structure and method for reducing polymer layer delamination | Electricity | 0 | Active |
| US11081475B2 | Integrated circuit structure and method for reducing polymer layer delamination | Electricity | 0 | Active |
| US11721882B2 | Semiconductor package having discrete antenna device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.