Heating modulators to improve epi uniformity tuning

US10132003B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Shu-Kwan LAU · Sunnyvale, US
• Surajit Kumar · Sunnyvale, US
• Joseph M. Ranish · San Jose, US
• Zhiyuan Ye · San Jose, US
• Kartik Shah · Saratoga, US
• Mehmet Tugrul Samir · Mountain View, US
• Errol Antonio C. Sanchez · Tracy, US

Key dates

• Filing date: Jul 21, 2017
• Grant date: Nov 20, 2018
• Expiry date: Jul 21, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67201
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Embodiments disclosed herein generally related to a processing chamber, and more specifically a heat modulator assembly for use in a processing chamber. The heat modulator assembly includes a heat modulator housing and a plurality of heat modulators. The heat modulator housing includes a housing member defining a housing plane, a sidewall, and an annular extension. The sidewall extends perpendicular to the housing plane. The annular extension extends outward from the sidewall. The plurality of heat modulators is positioned in the housing member.