Low-stress floating-chip pressure sensors
US10132705B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2016 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Jan 5, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/145
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods are disclosed for a pressure sensor device. The pressure sensor device includes a header that defines an interior cavity including one or more tether connecting regions. The header further defines an outer portion in communication with the interior cavity; the outer portion includes a plurality of through bores in communication with an exterior portion of the header for insertion of header pins through the header. The pressure sensor device includes a pressure sensor chip disposed within the interior cavity of the header. One or more anchoring tethers are attached to the corresponding one or more tether connecting regions. The pressure sensor chip is free to move within the interior cavity of the header, and the one or more anchoring tethers are in communication with the pressure sensor chip and are configured to limit movement of the pressure sensor chip within the header.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.