Method and apparatus for determining the property of a structure, device manufacturing method
US10133192B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2017 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Apr 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A structure of interest (T) is irradiated with radiation for example in the x-ray or EUV waveband, and scattered radiation is detected by a detector (19, 274, 908, 1012). A processor (PU) calculates a property such as linewidth (CD) or overlay (OV), for example by simulating (S16) interaction of radiation with a structure and comparing (S17) the simulated interaction with the detected radiation. The method is modified (S14a, S15a, S19a) to take account of changes in the structure which are caused by the inspection radiation. These changes may be for example shrinkage of the material, or changes in its optical characteristics. The changes may be caused by inspection radiation in the current observation or in a previous observation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.