Wafer carrier having thermal cover for chemical vapor deposition systems
US10134617B2 · kind B2 · utility
351Cited by
26References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2014 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Sep 4, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49837
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates generally to semiconductor fabrication technology and, more particularly, to chemical vapor deposition (CVD) processing and associated apparatus for addressing temperature non-uniformities on semiconductor wafer surfaces. Embodiments include a wafer carrier for use in a system for growing epitaxial layers on one or more wafers by CVD, the wafer carrier comprising a top plate and base plate which function coordinately to reduce temperature variability caused during CVD processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.