Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring
US10134649B2 · kind B2 · utility
1Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2016 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Jan 6, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/35121
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate; sensing chip-packaging interaction failure in the underfilled flip-chip module in situ; reporting in-situ chip-packaging interaction failure to a device in real-time; and imaging the chip-packaging interaction failure with an indirect scanning acoustic microscope.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.