Jonathan Fry
42Patents
3h-index
40Co-inventors
55Inventor score
Filing activity: Dec 18, 2014 → Dec 17, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10032683B2 | Time temperature monitoring system | Physics | 9 | Active |
| US10504807B2 | Time temperature monitoring system | Physics | 5 | Active |
| US10060974B2 | Electrical circuit odometer sensor array | Physics | 3 | Active |
| US10008427B2 | Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring | Electricity | 3 | Active |
| US10533919B2 | Electro-mechanical fuse for detecting monitored component deflection | Physics | 3 | Active |
| US9818655B2 | Method and structure for flip-chip package reliability monitoring using capacitive sensors groups | Electricity | 2 | Active |
| US10180337B1 | Optical deformation detection sensor and system having a material disposed on the inner surface of an elongated hollow housing | Physics | 2 | Active |
| US10697851B2 | Electro-mechanical fuse for detecting monitored component deflection | Physics | 2 | Active |
| US10415721B2 | Micro electrical mechanical system (MEMS) valve | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US10134649B2 | Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring | Electricity | 1 | Active |
| US10180338B1 | Optical deformation detection sensor and system | Physics | 1 | Active |
| US10957622B2 | Spatially localized thermal interface materials | Electricity | 0 | Active |
| US10545493B2 | Enhanced service procedures using force measurement | Physics | 0 | Active |
| US11876023B2 | Conformal film thickness determination using angled geometric features and vertices tracking | Electricity | 0 | Active |
| US10698394B2 | Enhanced service procedures using force measurement | Physics | 0 | Active |
| US10903184B2 | Filler particle position and density manipulation with applications in thermal interface materials | Electricity | 0 | Active |
| US10553503B2 | Method and structure for flip-chip package reliability monitoring using capacitive sensors groups | Electricity | 0 | Active |
| US10408691B2 | Fracture ring sensor | Electricity | 0 | Active |
| US10886364B2 | Vertical memory cell with mechanical structural reinforcement | Electricity | 0 | Active |
| US10942088B2 | Opto-mechanical fuse | Physics | 0 | Active |
| US11187349B2 | Micro electrical mechanical system (MEMS) valve | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US11960830B2 | Exploratory data interface | Emerging Cross-Sectional Technologies | 0 | Active |
| US11087502B2 | Multimodal data visualization using bandwidth profiles and optional environmental compensation | Physics | 0 | Active |
| US11113533B2 | Smart display apparatus and control system | Fixed Constructions | 0 | Active |
| US10528817B2 | Smart display apparatus and control system | Fixed Constructions | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.