Taryn J. Davis
11Patents
4h-index
18Co-inventors
46Inventor score
Filing activity: Jan 29, 2015 → Jul 24, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9401315B1 | Thermal hot spot cooling for semiconductor devices | Electricity | 11 | Active |
| US10032683B2 | Time temperature monitoring system | Physics | 9 | Active |
| US10504807B2 | Time temperature monitoring system | Physics | 5 | Active |
| US9437515B2 | Heat spreading layer with high thermal conductivity | Electricity | 5 | Active |
| US10008427B2 | Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring | Electricity | 3 | Active |
| US9911716B2 | Polygon die packaging | Electricity | 3 | Active |
| US9818655B2 | Method and structure for flip-chip package reliability monitoring using capacitive sensors groups | Electricity | 2 | Active |
| US10134649B2 | Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring | Electricity | 1 | Active |
| US10217682B2 | Time temperature monitoring system | Physics | 0 | Active |
| US10068812B2 | Method and structure for flip-chip package reliability monitoring using capacitive sensors groups | Electricity | 0 | Active |
| US10553503B2 | Method and structure for flip-chip package reliability monitoring using capacitive sensors groups | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.