Semiconductor devices having electrically and optically conductive vias, and associated systems and methods
US10141259B1 · kind B1 · utility
8Cited by
3References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2017 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Dec 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices having one or more vias filled with a transparent and electrically conductive material are disclosed herein. In one embodiment, a semiconductor device includes a first semiconductor die stacked over a second semiconductor die. The first semiconductor die can include at least one via that is axially aligned with a corresponding via of the second semiconductor die. The vias of the first and second semiconductor dies can be filled with a transparent and electrically conductive material that both electrically and optically couples the first and second semiconductor dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.