Bent-bridge semiconductive apparatus
US10141265B2 · kind B2 · utility
0Cited by
1References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2016 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | Dec 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bent-bridge semiconductive apparatus includes a silicon bridge that is integral to a semiconductive device and the silicon bridge is deflected out of planarity. The silicon bridge may couple two semiconductive devices, all of which are from an integral processed die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.