Support unit, substrate treating apparatus including the same, and method for treating a substrate
US10153137B2 · kind B2 · utility
0Cited by
1References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2016 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Nov 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The inventive concepts provide a substrate treating apparatus. The substrate treating apparatus includes a process chamber in which a treatment space is provided, a support unit supporting a substrate in the process chamber, a gas supply unit supplying a gas into the process chamber, and a plasma source generating plasma from the gas. The support unit includes a support plate on which a substrate is loaded, a focus ring disposed to surround the support plate, an electric field adjusting ring disposed under the focus ring, and an actuator vertically moving the electric field adjusting ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.