Crack stop with overlapping vias
US10153232B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2017 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Apr 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/5226
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A crack stop structure for an integrated circuit (IC) structure is disclosed. The structure can include: a first crack stop pillar laterally separated from a second crack stop pillar within an insulator region of the IC structure. The first crack stop pillar can include an overlapping via in contact with a top surface and at least one side surface of a first conductive element therebelow. The overlapping via of the first crack stop pillar may be in a given layer of the IC structure, and the second crack stop pillar may include a via in the given layer, the via extending to a different depth than the overlapping via. The via of the second crack stop pillar may be an overlapping via in contact with a top surface and at least one side surface of a second conductive element therebelow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.