3DIC packaging with hot spot thermal management features
US10157813B2 · kind B2 · utility
4Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2017 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Aug 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.