Methods of cooling packaged semiconductor devices
US10157818B2 · kind B2 · utility
14Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2015 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Jul 12, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes a substrate including a semiconductor device mounting region, a cover coupled to a perimeter of the substrate, and members disposed between the substrate and the cover. The package includes partitions, with each partition being disposed between two adjacent members. The package includes a fluid inlet port coupled to the cover, and a fluid outlet port coupled to one of the partitions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.