Method for forming a lid structure for a semiconductor device package
US10157863B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2017 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Nov 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15313
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a substrate and a die structure formed over the substrate. The semiconductor device structure also includes a lid structure formed over the die structure. The lid structure includes a top portion with a top length and a bottom portion with a bottom length, and the top length is greater than the bottom length. The semiconductor device structure also includes a package layer formed between the lid structure and the die structure, and a sidewall of the bottom portion of the lid structure is not aligned with a sidewall of the die structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.