Carrier head membrane roughness to control polishing rate
US10160093B2 · kind B2 · utility
4Cited by
56References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2009 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Dec 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge portion surrounding the central portion, wherein the central portion has a first surface roughness and the edge portion has a second surface roughness, the first surface roughness being greater than the second surface roughness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.