Projection exposure apparatus including mechanism to reduce influence of pressure fluctuations
US10162267B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2015 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Sep 9, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/709
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention relates to a projection exposure apparatus for semiconductor lithography, comprising an illumination system for illuminating a mask arranged on a movable mask stage, and comprising a projection lens for imaging the mask onto a semiconductor substrate, wherein at least one means is present for at least partly decoupling at least parts of the illumination system and/or of the projection lens from the influence of pressure fluctuations in the medium surrounding the projection lens or the illuminated system, the pressure fluctuations being attributed to movements of the mask stage during the operation of the apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.