Linear wafer drive for handling wafers during semiconductor fabrication
US10163667B2 · kind B2 · utility
0Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2008 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Sep 5, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A modular cluster tool is disclosed. According to one embodiment, a system, comprises a wafer transfer station that includes a first vacuum chamber that stores a plurality of semiconductor wafers. The system also includes an equipment front end module interface, and two or more shuttle lock interfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.