Surface mount package and manufacturing method thereof
US10163819B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2015 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Nov 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/35121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a surface-mount type package whose face parallel with the semiconductor chip surface has a circular cross-section, is characterized by including at least the following steps in this order: a first step in which a semiconductor chip is bonded onto a circular support substrate; a second step in which the semiconductor chip is sealed with resin; a third step in which the resin covering the pads of the semiconductor chip is removed; a fourth step in which a rewiring layer is formed; and a fifth step in which bumps are formed. The method can provide a surface-mount type package for semiconductor chips which is resistant to failures caused by thermal stress.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.