Fumito IMURA
4Patents
0h-index
4Co-inventors
24Inventor score
Filing activity: Nov 16, 2015 → Mar 28, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11056410B2 | Method of manufacturing semiconductor package using alignment mark on wafer | Electricity | 0 | Active |
| US10163819B2 | Surface mount package and manufacturing method thereof | Electricity | 0 | Active |
| US10304675B2 | System for integrating preceding steps and subsequent steps | Electricity | 0 | Active |
| US10163674B2 | Circular support substrate for semiconductor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.