Image processing package and camera module having same
US10165169B2 · kind B2 · utility
1Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2014 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Mar 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16145
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides an image processing package comprising: an image sensor for receiving an image of a subject, which is incident from the outside, in the form of light and converting the image of the subject into an image signal; and an image signal processor for processing the image signal which is output from the image sensor and reproducing the image of the subject, wherein the image processing package has a structure in which the image sensor is vertically stacked on the image signal processor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.