Wafer processing with carrier extension
US10167554B2 · kind B2 · utility
0Cited by
18References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2011 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Oct 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus for treating wafers using a wafer carrier rotated about an axis is provided with a ring which surrounds the wafer carrier during operation. Treatment gasses directed onto a top surface of the carrier flow outwardly away from the axis over the carrier and over the ring, and pass downstream outside of the ring. The outwardly flowing gasses form a boundary over the carrier and ring. The ring helps to maintain a boundary layer of substantially uniform thickness over the carrier, which promotes uniform treatment of the wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.