Dummy pattern addition to improve CD uniformity
US10170309B2 · kind B2 · utility
1Cited by
10References
5Claims
0Family size
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Key dates
| Filing date | Feb 15, 2017 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Feb 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/903
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multiple exposure patterning process includes the incorporation of a dummy feature into the integration flow. The dummy feature, which is placed to overlie an existing masking layer and thus does not alter the printed image, improves the critical dimension uniformity (CDU) of main critical (non-dummy) features at the same masking level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.