Patent · US Active

Cooling structure for electronic boards

US10172258B2 · kind B2 · utility

5Cited by

10References

10Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Paul F. Bodenweber · Kingston, US
Kenneth C. Marston · Poughquag, US
Kamal K. Sikka · Poughkeepsie, US
Hilton T. Toy · Hopewell Junction, US
Randall J. Werner · Poughkeepsie, US
Jeffrey A. Zitz · Poughkeepsie, US

Key dates

Filing date	Mar 17, 2017
Grant date	Jan 1, 2019
Priority date	—
Expiry date	Mar 17, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/2018
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.