Thermal radiation barrier for substrate processing chamber components

US10177014B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Govinda Raj · Kanchinakote, IN
• Daniel L. Martin · Palo Alto, US
• Robert T. Hirahara · San Jose, US
• Ashish Bhatnagar · Fremont, US
• Bopanna Vasanth · Bengaluru, IN
• Prashanth Rao · Bengaluru, IN
• Kadthala Ramaya Narendrnath · San Jose, US

Key dates

• Filing date: Oct 9, 2013
• Grant date: Jan 8, 2019
• Expiry date: Jun 4, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68792
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An apparatus for a substrate support heater and associated chamber components having reduced energy losses are provided. In one embodiment, a substrate support heater is provided. The substrate support heater includes a heater body having a first surface to receive a substrate and a second surface opposing the first surface, a heating element disposed in the heater body between the first surface and the second surface, and a thermal barrier disposed on the second surface of the heater body, wherein the thermal barrier comprises a first layer and a second layer disposed on the first layer.