Method and apparatus for filling a gap
US10177025B2 · kind B2 · utility
398Cited by
725References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 28, 2016 |
| Grant date | Jan 8, 2019 |
| Priority date | — |
| Expiry date | Jul 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0228
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for filling one or more gaps created during manufacturing of a feature on a substrate by: providing a bottom area of a surface of the one or more gaps with a first reactant; providing a second reactant to the substrate; and, allowing the first reactant to initiate reaction of the second reactant in the bottom area of the surface in a stoichiometric ratio of one molecule of the first reactant to multiple molecules of the second reactants leaving a top area of the surface of the one or more gaps which was not provided with the first reactant initially substantially empty.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.