Patent · US Active

Defective die replacement in a die stack

US10177052B2 · kind B2 · utility

3Cited by

5References

13Claims

0Family size

Assignee

NXP USA, Inc. · US

Inventors

Perry H. Pelley · Austin, US
Michael B. McShane · Austin, US
Tim V. Pham · Austin, US

Key dates

Filing date	Apr 8, 2014
Grant date	Jan 8, 2019
Priority date	—
Expiry date	Dec 22, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The dies of a stacked die IC are tested and, in response to detection of a defect at one of the dies, the type of defect is identified. If the defect is identified as a defective module repairable at the die itself, a redundant module of the die is used to replace the functionality of the defective module. If the defect is identified as one that is not repairable, a replacement die in the die stack is used to replace the functionality of the defective die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.