Inventor · Austin, TX, US

Tim V. Pham

15Patents
4h-index
13Co-inventors
53Inventor score

Filing activity: Feb 28, 2002 → Sep 10, 2015

Most-cited inventions

PatentTitleAreaCited byStatus
US7772104B2 Dynamic pad size to reduce solder fatigue Emerging Cross-Sectional Technologies 11 Active
US8860212B1 Fluid cooled semiconductor die package Electricity 7 Active
US6905891B2 Method for processing multiple semiconductor devices for test Electricity 7 Expired
US8008786B2 Dynamic pad size to reduce solder fatigue Emerging Cross-Sectional Technologies 4 Active
US9281256B2 Package encapsulant relief feature Electricity 3 Active
US10177052B2 Defective die replacement in a die stack Electricity 3 Active
US9318451B2 Wirebond recess for stacked die Electricity 2 Active
US9480161B2 Thin low profile strip dual in-line memory module Emerging Cross-Sectional Technologies 1 Active
US8957510B2 Using an integrated circuit die configuration for package height reduction Electricity 0 Active
US9070657B2 Heat conductive substrate for integrated circuit package Electricity 0 Active
US9159643B2 Matrix lid heatspreader for flip chip package Electricity 0 Active
US9087702B2 Edge coupling of semiconductor dies Electricity 0 Active
US10002653B2 Die stack address bus having a programmable width Electricity 0 Active
US9640469B2 Matrix lid heatspreader for flip chip package Electricity 0 Active
US8970026B2 Methods and structures for reducing stress on die assembly Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.