Processes for photolithography
US10180627B2 · kind B2 · utility
0Cited by
13References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2010 |
| Grant date | Jan 15, 2019 |
| Priority date | — |
| Expiry date | Jun 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0274
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
New lithographic processing methods are provided which are particularly useful in immersion lithography schemes. In one aspect, processes of the invention comprise: applying on a substrate a photoresist composition; exposing the photoresist layer to radiation activating for the photoresist composition; removing a portion but not all of the exposed photoresist layer; and developing the treated photoresist layer to provide a photoresist relief image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.