Methods of post-process dispensation of plasma induced damage protection component
US10181713B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2014 |
| Grant date | Jan 15, 2019 |
| Priority date | — |
| Expiry date | Sep 16, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
At least one method, apparatus and system disclosed herein involves providing an integrated circuit device comprising a protection circuit. And integrated circuit device is formed. A protection component is formed in parallel to the integrated circuit device. The protection component is configured for protecting the integrated circuit device from a portion of a charge. A circuit break device in series to the protection component, wherein the protection component and the circuit break device are in parallel to the integrated circuit device. The circuit break device is configured to break an electrical path of the protection component for electrically terminating the protection component based upon a current signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.