Patent · US Active

Method and apparatus for use in wafer processing

US10186438B2 · kind B2 · utility

1Cited by

3References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Fischer · Umkirch, DE
Gerald Lackner · Arnoldstein, AT
Walter Leitgeb · Wernberg, AT
Michael Lecher · Villach, AT

Key dates

Filing date	Nov 5, 2015
Grant date	Jan 22, 2019
Priority date	—
Expiry date	Nov 5, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67092
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method and an apparatus for use in processing a wafer are disclosed. In an embodiment the method includes providing a wafer on a receptacle, shining a light at an edge of the wafer and based on light that passed the edge of the wafer, processing the wafer on the receptacle.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.