Gerald Lackner
25Patents
6h-index
42Co-inventors
69Inventor score
Filing activity: Nov 24, 1987 → Jan 26, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4809540A | Method and apparatus for testing internal combustion engines | Physics | 30 | Expired |
| US5107213A | Method and apparatus for signal evaluation of zero-axis crossings | Mechanical Engineering; Lighting; Heating | 8 | Expired |
| US8202786B2 | Method for manufacturing semiconductor devices having a glass substrate | Electricity | 7 | Active |
| US8546934B2 | Method for manufacturing semiconductor devices having a glass substrate | Electricity | 7 | Active |
| US8226144B2 | Motor vehicle with extendible vehicle body | Performing Operations; Transporting | 6 | Active |
| US6443195B2 | Filler neck | Fixed Constructions | 6 | Expired |
| US4791808A | Method of diagnosis of multi-cylinder internal combustion engines and means for carrying out the method | Physics | 4 | Expired |
| US6547089B2 | Tank cap | Emerging Cross-Sectional Technologies | 3 | Expired |
| US9177893B2 | Semiconductor component with a front side and a back side metallization layer and manufacturing method thereof | Electricity | 3 | Active |
| US8857805B2 | Method, apparatus for holding and treatment of a substrate | Electricity | 2 | Active |
| US8803312B2 | Method for manufacturing semiconductor devices having a glass substrate | Electricity | 2 | Active |
| US10186438B2 | Method and apparatus for use in wafer processing | Electricity | 1 | Active |
| US8865522B2 | Method for manufacturing semiconductor devices having a glass substrate | Electricity | 1 | Active |
| US11302579B2 | Composite wafer, semiconductor device and electronic component | Electricity | 1 | Active |
| US8822310B2 | Method, apparatus for holding and treatment of a substrate | Electricity | 1 | Active |
| US10672664B2 | Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor device | Electricity | 1 | Active |
| US12148640B2 | Method and apparatus for use in wafer processing | Electricity | 0 | Active |
| US12205842B2 | Wafer chuck for a laser beam wafer dicing equipment | Electricity | 0 | Active |
| US8993372B2 | Method for producing a semiconductor component | Emerging Cross-Sectional Technologies | 0 | Active |
| US10985041B2 | Method and apparatus for use in wafer processing | Electricity | 0 | Active |
| US10777444B2 | Wafer arrangement and method for processing a wafer | Electricity | 0 | Active |
| US11637028B2 | Method and apparatus for use in wafer processing | Electricity | 0 | Active |
| US11712749B2 | Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices | Electricity | 0 | Active |
| US11848237B2 | Composite wafer, semiconductor device and electronic component | Electricity | 0 | Active |
| US9966293B2 | Wafer arrangement and method for processing a wafer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.