Patterning for substrate fabrication
US10186542B1 · kind B1 · utility
2Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2017 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | Jul 20, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/38
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Various examples of a technique for forming a pattern for substrate fabrication are disclosed herein. In an example, a method includes receiving a substrate. A patterned resist is formed on the substrate and has a trench defined therein. A dielectric is deposited on the patterned resist and within the trench such that the dielectric narrows a width of the trench to further define the trench. A fabrication process is performed on a region of the substrate underlying the trench defined by the dielectric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.