Ching-Sen Kuo
33Patents
4h-index
49Co-inventors
63Inventor score
Filing activity: Jul 14, 2000 → Aug 10, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6645851B1 | Method of forming planarized coatings on contact hole patterns of various duty ratios | Physics | 41 | Expired |
| US6803291B1 | Method to preserve alignment mark optical integrity | Electricity | 17 | Expired |
| US7443005B2 | Lens structures suitable for use in image sensors and method for making the same | Electricity | 12 | Expired |
| US6632590B1 | Enhance the process window of memory cell line/space dense pattern in sub-wavelength process | Physics | 4 | Expired |
| US10546889B2 | Method of high-aspect ratio pattern formation with submicron pixel pitch | Electricity | 3 | Active |
| US10121811B1 | Method of high-aspect ratio pattern formation with submicron pixel pitch | Electricity | 3 | Active |
| US7189957B2 | Methods to improve photonic performances of photo-sensitive integrated circuits | Electricity | 2 | Expired |
| USRE41697E1 | Method of forming planarized coatings on contact hole patterns of various duty ratios | General | 2 | Expired |
| US10090357B2 | Method of using a surfactant-containing shrinkage material to prevent photoresist pattern collapse caused by capillary forces | Electricity | 2 | Active |
| US8809172B2 | Self-aligned patterning for deep implantation in a semiconductor structure | Electricity | 2 | Active |
| US10186542B1 | Patterning for substrate fabrication | Physics | 2 | Active |
| US10734436B2 | Method of using a surfactant-containing shrinkage material to prevent photoresist pattern collapse caused by capillary forces | Electricity | 1 | Active |
| US11769662B2 | Method for reducing charging of semiconductor wafers | Electricity | 1 | Active |
| US9040341B2 | Image device and methods of forming the same | Electricity | 1 | Active |
| US11049767B2 | Semiconductor device and methods of manufacturing thereof | Electricity | 1 | Active |
| US10510587B2 | Method for manufacturing semiconductor device | Electricity | 1 | Active |
| US11658031B2 | Implantation mask formation | Electricity | 1 | Active |
| US11996432B2 | Image sensor device and manufacturing method thereof | Electricity | 0 | Active |
| US9437650B2 | Image device and methods of forming the same | Electricity | 0 | Active |
| US9917006B1 | Method of planarizating film | Electricity | 0 | Active |
| US10910260B2 | Method for manufacturing semiconductor device | Electricity | 0 | Active |
| US11276699B2 | Surface topography by forming spacer-like components | Electricity | 0 | Active |
| US12165867B2 | Method for reducing charging of semiconductor wafers | Electricity | 0 | Active |
| US11411033B2 | Image sensor device and manufacturing method thereof | Electricity | 0 | Active |
| US10943783B2 | Method for manufacturing a semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.