Method for making contact with a component embedded in a printed circuit board
US10187997B2 · kind B2 · utility
4Cited by
32References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2015 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | Feb 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods for the bonding of a component embedded into a printed circuit board are provided. A printed circuit board is also provided with at least one insulated layer and at least one structured conductor layer with conductor paths, with at least one component, which, by means of an adhesive layer, is embedded into a recess of the printed circuit board, with its contacts essentially being situated in the plane of an outer surface of the printed circuit board exhibiting the at least one conductor layer, and with conductive connections between the contacts of the components and the conductor paths of the conductor layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.