Chamber components with polished internal apertures
US10189141B2 · kind B2 · utility
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24References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2017 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Jun 9, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23B2226/18
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.