Methods of making semiconductor device modules with increased yield
US10192843B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2017 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Jul 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of making semiconductor device modules may involve forming holes in a sacrificial material and placing an electrically conductive material in the holes. The sacrificial material may be removed to expose posts of the electrically conductive material. A stack of semiconductor dice may be placed between at least two of the posts after removing the sacrificial material, one of the semiconductor dice of the stack including an active surface facing in a direction opposite a direction in which another active surface of another of the semiconductor dice of the stack. The posts and the stack of semiconductor dice may be at least laterally encapsulated in an encapsulant. Bond pads of the one of the semiconductor dice may be electrically connected to corresponding posts after at least laterally encapsulating the posts and the stack of semiconductor dice.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.